Webincoming STI wafers and pattern designs, compounded with drifts in CMP process performance due to continual pad and disc wear can lead to large variations in within-wafer and wafer-to-wafer polishing.17–21 These variations lead to wafers that would either need re-work to clear the residual overburden layer, or over-polished http://www.solidustech.com/STI3000WaferProbeTestSystem.html

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WebFUSED SILICA WAFER. “Fused Silica” or “Fused Quartz” which is the amorphous phase of quartz (SiO2). When contrasted to borosilicate glass, fused silica has no additives; hence it exists in its pure form, SiO2. Fused silica has a higher transmission in the infrared and ultraviolet spectrum when compared to normal glass. WebSince the device stacks (c-Si wafer, intrinsic and doped a-Si:H layers and Ag grid) were identical throughout the fabrication process, and considering the similar R sh of the PLD and sputtered ITO (60 Ω −1 measured on the a-Si:H/c-Si, Fig. 2(a)), the resistive loss is likely to originate from the ρ c at the doped a-Si:H/TCO interface. dr. henderson cardiology tulsa

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